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框架材料铜带系列案例

2019-03-15 10:20:03 202

深圳金运昌有色金属有限公司

材料特性：良好的强度支撑和导电导热♀性能等

典型用途：半导体、二极管等电子元器件，如IC框架、LED引线框架、分立器件、迷你电桥、手机中板等

可供应范围：厚度：0.1-3.0mm 宽度：小于等于610mm